Dry Stack Method for Tailings and Nickel Slag Placement
As in any mineral processing industry, in addition to main products, by-products are also produced as residual processing results (waste). TBP Tbk is strongly committed to responsible management of its waste to mitigate and prevent negative impacts to humans and the environment. The company have obtained all required government permits for our waste management facilities, and follow relevant requirements and good practices. TBP Tbk does not conduct Deep Sea Tailings Placement.
The residual products from manufacturing, refining, and smelting processes at TBP Tbk produce two types of residual materials, namely:
1) Tailings as residual manufacturing results from the hydrometallurgical High Pressure Acid Leach process.
2) Nickel slag from the pyrometallurgical Rotary Kiln Electric Furnace smelting process.
Tailings and nickel slag are placed in separate facilities, and both are managed according to their specific characteristics in compliance with the government permits of each facility. Additionally, both materials do not contain hazardous chemicals, are non-corrosive, non-toxic, non-flammable, nor explosive.
Tailings Placement Facility
Tailings are placed on ex-mine land through the Dry Stack Tailings Facility method. This facility is located close to the HPAL plant with a water content of about 30% such as limonite native soil. Dry Tailing storage is useful to cover the ex-mining pit, and it is safe for the environment according to research by AME Mineral Economics Pty Ltd.
Nickel Slag Recycling
Nickel slag is categorized as non-hazardous waste according to Indonesian regulations (Government Regulation no. 22 of 2021). As a demonstration of TBP’s commitment to reuse, we obtained a government permit to utilize nickel slag as a component of building materials such as concrete blocks and bricks in building construction, roads, water pipes, and other facilities. To ensure their safety aspect to the environment and health, we conduct toxicity tests on our nickel slag.